Board-Level Heat Sinks, Matched to Your PCB

Control component temperature without compromising electrical clearance, board space or repeatable assembly. Morton develops compact aluminum and copper heat sinks around your device and operating conditions.

TO-220 / TO-247 / BGA integration

10–80 mm typical footprint

Thermal + mechanical review

Start with your package, power loss and available space. Discuss Your Board Cooling

Compact black anodized aluminum board-level heat sink with mounting flange

Compact Cooling at the Component Level

A board-level heat sink transfers heat from a discrete power device or board-mounted package into the surrounding air. The interface, retention method and local airflow determine how well it works in your assembly.

Direct thermal path

Add useful surface area close to the device instead of consuming the whole enclosure.

Package-aware geometry

Protect lead clearance, neighboring components and access for assembly.

A complete attachment concept

Coordinate the metal part, interface and retention method from the start.

Turn a small cooling component into a dependable part of your assembly. Review Your Package

Solve the Constraints That Actually Limit Your Board

Compact electronics need more than extra fins. We review the thermal, electrical and mechanical constraints together so the cooling part fits the complete design.

Temperature margin

Match power loss, inlet air and junction-temperature target before choosing geometry.

Crowded PCB layout

Define height, connector access and keep-out zones around the package.

Electrical clearance

Identify live tabs, creepage paths and insulating hardware early.

Assembly consistency

Control the interface and mounting load to reduce variation between builds.

Follow the Heat Path from Junction to Air

Each interface contributes to the final temperature rise. A clear thermal path helps you improve the part of the assembly that creates the greatest resistance.

Stage 01

Junction → Case

Use the device data and the relevant heat-flow path.

Stage 02

Case → Interface

Set material, contact area and controlled compression.

Stage 03

Interface → Heat sink

Maintain a flat, clean contact region and repeatable retention.

Stage 04

Heat sink → Air

Account for installed airflow, fin direction and nearby obstructions.

See the complete path

The smallest interface can become the dominant bottleneck.

Design for real conditions

Validate temperatures in the intended enclosure and board orientation.

Package Compatibility Without Assembly Surprises

We adapt the mounting concept to the package drawing and PCB layout, keeping thermal contact and electrical safety in the same review.

TO-220 Devices

Review tab contact, screw or clip retention and lead access.

Check live-tab isolation.
Define lead-to-sink clearance.

TO-247 Devices

Provide a contact region and mounting load suited to the larger package.

Verify package-specific loading.
Preserve adjacent component space.

BGA & Board-Mounted Packages

Align the top interface and board retention with the actual package stack.

Protect the package from excessive load.
Keep connector and service access.

Send the package drawing and the PCB keep-out envelope.

Check Package Compatibility

Size the Heat Sink Around a Thermal Budget

Start with allowable temperature rise and dissipated power. Then allocate resistance to the device, the interface and the heat sink in the actual cooling environment.

Required inputs

Dissipated power, not rated electrical power.
Maximum inlet-air temperature.
Junction-temperature design target.

Governing Thermal Relationship

For a predominantly case-to-sink heat path:

RθSA ≤ (TJ,target − TA) / PD − RθJC − RθCS

RθSA heat sink to ambient
RθJC junction to case
RθCS case to heat sink

Validate the result

Critical physical boundary parameters to confirm during evaluation

Package heat paths

Actual airflow

Mounting orientation

Interface and retention

Report useful conditions: Record source size, power, inlet temperature, airflow and measurement locations with the thermal result.

Bring your power loss and temperature target for a focused review.

Build Your Thermal Budget

Fit the Cooling Surface into Your PCB Envelope

Footprint, height and attachment features are developed together so the heat sink clears nearby parts and supports repeatable placement.

Envelope Bounding Dimensions

3D Keep-Out Envelope

Max Component Height: 5–50 mm

Coordinated with package z-height and air path

10–80 mm

Typical length

10–80 mm

Typical width

5–50 mm

Typical height

Keep-out definition

Include connectors, test points, tall capacitors and service access.

Fin orientation

Align useful channels with the intended airflow or natural-convection path.

Contact region

Match the package surface and leave a practical tolerance stack.

Retention access

Provide room for clips, screws or board anchors and assembly tools.

Make the cooling concept fit before the PCB layout is frozen.

Review Your PCB Envelope

Choose Material and Finish for the Interface

Aluminum and copper provide different balances of weight, heat spreading and manufacturing cost. Surface finish is selected with the contact region and electrical requirements in view.

Aluminum

A practical balance of low mass, useful surface area and production cost for compact board cooling.

Copper

Useful where local spreading or a restricted envelope supports the additional mass and cost.

Interface Surface Finish Specification

Black anodizing

Aluminum surfaces; define contact, grounding and thread masking.

Nickel plating

Available for selected copper interfaces and handling requirements.

Machined contact areas

Specify the final surface condition on the controlled drawing.

Electrical insulation

Treat it as a verified interface system; do not rely on finish alone.

Balance heat spreading, handling and final assembly cost.

Discuss Material and Finish

Control the Interface. Protect the Circuit

The right interface combines useful heat transfer with the insulation and mechanical behavior your package requires.

Thermal Contact

Select bond-line thickness and contact pressure around the actual surfaces. A thin interface is useful only when it makes reliable contact.

Electrical Isolation

Review the live tab, dielectric interface, shoulder bushings and clearance as one system where isolation is required.

Retention Stability

Match clip force, spring travel or fastener torque to the device and interface requirements.

Assembly checks:

Clean contact faces • Controlled compression • Insulated fastener path where required • No load on device leads

Compact finned heat sink seated on an IC package with external spring screws and PCB mounting anchors

Retention Designed for Repeatable Assembly

A stable attachment maintains thermal contact through handling and operation while keeping package and board loads under control.

Define the load path

Carry retention loads through suitable package or board features.

Select the attachment

Compare clips, spring fasteners and approved board retention features.

Set the installation method

Document loading, compression, tool access and inspection criteria.

Verify the assembled board

Check package stress, movement, clearance and thermal contact after assembly.

Board Cooling for Real Industrial Electronics

Compact thermal parts support power conversion, control and connectivity where space and reliable operation matter.

Industrial open-frame AC/DC power supply board with small board-level heat sinks on MOSFETs

Power Hardware

Industrial Power Supplies

Cool rectifiers, switching devices and local conversion stages within a constrained power board.

Control Architecture

Automation & Control

Manage device temperatures around dense control electronics and limited airflow.

Industrial edge computing motherboard with compact heat sink cooling processing IC near dual Ethernet ports

Embedded Platforms

Industrial Computing & Networking

Support local hot spots near DC/DC stages and board-mounted processing devices.

Show us the board and the operating environment behind your application.

Discuss Your Application

Verify the Part and the Assembled Result

Inspection connects the controlled drawing to the actual board. Thermal evaluation is tied to documented conditions rather than an isolated headline number.

Dimensional checks

Verify contact areas, holes, overall height and the defined PCB envelope.

Surface and edge checks

Inspect finish coverage, masking, burrs and handling damage.

Assembly review

Confirm interface placement, retention and clearance on the intended stack.

Thermal evaluation

Record load, local air temperature, board orientation and measurement positions.

Define acceptance criteria before the first production batch.

Plan Your Validation

From Your Drawing to a Repeatable Supply Part

Engineering, sampling and production use the same revision logic so the approved design can move into your BOM with clear inspection and delivery requirements.

Phase 01

Requirement review

Package drawing, power loss, keep-out space, airflow and volume.

Phase 02

Design & DFM

Material, geometry, interface, retention and inspection features.

Phase 03

Sample approval

Confirm fit, function and agreed acceptance evidence.

Phase 04

Production release

Lock drawing revision, packaging, batch identity and release records.

RFQ essentials

2D/3D files, target quantity, finish, installation concept and delivery destination.

Supply coordination

Align forecasts, sample feedback and revision changes with a named project contact.

Move from a cooling concept to a controlled part in your supply chain.

Start Your RFQ Review

Questions Engineers Ask Before Selection

Resolve the key design assumptions early to keep package compatibility, validation and sourcing aligned.

Can one heat sink suit every TO-220 or TO-247 device?

No. Package outline, tab potential, power loss, allowable mounting load and available airflow must be checked for the specific device.

Does a black finish guarantee electrical insulation?

No. Where isolation is required, specify an appropriate dielectric interface and insulating mounting features, then validate the complete assembly.

Is a taller or denser fin arrangement always better?

Available airflow and pressure, fin spacing, orientation and surrounding obstructions determine whether the additional surface is useful.

Can a published thermal resistance be used directly on my PCB?

Compare the test conditions first. Source geometry, airflow, power, orientation and interface differences can change the result.

Can you supply the interface and mounting parts together?

Yes. Morton can coordinate selected thermal pads, tapes and mounting hardware around the approved assembly requirement.

What should I send for an initial review?

Send the device drawing, PCB space, dissipated power, inlet-air temperature, airflow details and target quantities. A preliminary drawing is enough to start the discussion.

Have a package or integration question that needs a closer look?

Ask an Engineering Question

Let’s Review Your Board-Level Cooling Requirement

Send your package, thermal target and PCB constraints. We will help define a practical heat sink, interface and mounting concept for your next build.

Package-aware thermal review

PCB clearance and mounting coordination

Aluminum and copper manufacturing options

Interface materials and hardware support

Sample-to-production drawing control