Thermal Tapes for Reliable Heat Sink Attachment

Combine heat transfer and adhesive mounting in one thin interface, with material selection and die-cut support for your lightweight thermal assemblies.

0.6–2 W/(m·K) | 0.1–0.5 mm thickness | Custom die-cut support

Start with your surface, footprint and operating conditions.

Discuss Your Tape Requirement

Macro view of industrial thermal tape roll with peeled blue liner and die-cut parts

One Thin Interface. Two Essential Jobs

Thermal tape forms a conductive adhesive layer between a heat source and a lightweight heat sink, helping you simplify positioning and assembly.

Transfer heat across the interface

A thin, conformable bond line helps connect mating surfaces without a separate grease application.

Position and retain lightweight parts

Double-sided adhesion supports compact attachments where bond area, mass and operating loads are suitable.

Supply a part that fits your process

Choose a controlled material and cut outline, then add a practical liner and handling format.

Bring the thermal interface and assembly process into one discussion.

Review Your Assembly

Heat Transfer Starts at the Bond Line

Thickness, contact area and surface contact work together to determine the interface temperature rise.

Thermal Interface Cross-Section

Schematic representation (not to geometric scale)

Direction of Conductive Heat Flow (Device → Heat Sink)

Heat Sink Base (Mating Face) Aluminum / Finish

Thermal Tape Bond Line

Thickness: 0.1–0.5 mm | Conductive Acrylic/Silicone

Bond Line (t)

Component Package / Heat Source IC / Substrate

Primary conduction path across the uniform adhesive footprint.

Keep the layer thin

For a given material and area, a shorter conduction path reduces the bulk thermal resistance.

Use the available footprint

A larger bonded area supports heat flow and distributes mechanical load.

Control the contact

Clean mating faces and even application pressure help the adhesive wet the surfaces.

Bulk Resistance Relation

Rbulk = t / (k × A)

The total interface resistance also includes contact effects at both surfaces.

Share your contact footprint and thermal budget.

Review the Thermal Path

Choose the Thickness Your Interface Needs

Select the tape as part of the assembly: balance thermal resistance, surface conformity and dimensional control.

Thermal conductivity

0.6–2 W/(m·K)

Nominal thickness

0.1–0.5 mm

Common service range

−20 to 120 °C

Supply geometry

Rolls or die-cut parts

Start with the mating surfaces

Use the thinnest practical layer that can accommodate the approved surface condition and flatness.

Confirm the selected material

Conductivity, temperature rating, adhesion and electrical properties are tied to the chosen material specification.

Get a material recommendation around your actual interface.

Request Material Selection

Turn Contact Area into a Stronger Bond

A reliable attachment begins with the footprint and load direction, then follows through to the finished assembly.

Use a continuous footprint

Match the cut shape to the usable heat sink base, keeping adhesive clear of holes, edges and restricted areas.

Minimize peel and leverage

Keep the attached mass close to the interface and review cable forces, shock and installation orientation.

Verify the assembled joint

Evaluate holding performance after application dwell and the temperature exposure your product will see.

Key Engineering Inputs

Bonded area Attached mass Load direction Temperature exposure

Let us check the bond footprint before you commit the drawing.

Check Your Bond Design

Match the Tape to Your Substrate

Material selection includes the surface finish and cleanliness of both sides of the joint.

Machined aluminum

Review roughness, flatness and residual machining fluid so the adhesive can make consistent contact.

Anodized aluminum

Confirm the coating condition and use representative finished samples for adhesion testing.

Copper contact faces

Control oxidation and handling contamination before bonding to the approved surface.

Component and coated surfaces

Check the package finish, coating adhesion and material compatibility using the actual production substrate.

Send the finish specification for both mating surfaces.

Check Surface Compatibility

Build Reliability around Your Real Loads

Adhesive performance depends on time, temperature and mechanical loading as well as initial tack.

Temperature exposure

Review continuous temperature, short peaks and the combined effect of heat and sustained load.

Static shear

Test the mounted mass in its working orientation, including the specified dwell and aging period.

Shock and vibration

Evaluate the complete assembly and add mechanical retention when the load case requires it.

Thermal cycling

Inspect bond integrity and thermal performance after cycling between the agreed temperature limits.

Describe the load case you need the joint to survive.

Discuss Reliability Testing

Designed for Lightweight Thermal Assemblies

Use thermal tape where a thin conductive adhesive joint matches the heat load, attachment mass and assembly method.

Board-level heat sinks

Attach compact aluminum heat sinks to suitable flat package surfaces after thermal and retention validation.

LED support assemblies

Bond lightweight LED boards to compatible aluminum surfaces with a controlled, continuous tape footprint.

Communication modules

Position small heat spreaders in compact electronic assemblies with accessible mating faces.

Industrial control electronics

Support repeatable heat sink attachment in low-mass control and interface modules.

Check whether tape suits your application and load case.

Review Your Application

Precision die-cut thin thermal conductive adhesive parts on blue release liner with pull tabs

Die-Cut to Your Assembly, Ready for Your Line

A defined outline, practical liner and controlled packing format help operators place each tape part consistently.

Outline to drawing

Supply rectangles, shaped outlines and clearance cutouts against an approved cut drawing.

Handling that makes sense

Review liner tabs and peel access so operators can expose the adhesive without touching it.

A format for your workflow

Discuss individual pieces, sheets or a roll-fed format around handling and volume.

Clear part identification

Link material, drawing revision and batch labels to the approved supply specification.

Send your cut outline, liner preference and expected volume.

Discuss a Die-Cut Part

A Repeatable Bonding Process

Turn the selected tape into a controlled assembly step with clean surfaces, consistent placement and a defined dwell.

01 · Prepare

Clean and dry both mating surfaces using a method compatible with the substrate.

02 · Position

Apply the tape without wrinkles, trapped contamination or contact with the adhesive.

03 · Press

Remove the remaining liner, align the parts and apply even pressure as specified for the material.

04 · Dwell and verify

Allow the agreed bond development period before loading, then check placement and retention.

Define an assembly sequence your production team can repeat.

Review the Bonding Process

Validate Thermal Performance and Bond Strength

Evaluate the selected tape in a joint that represents your real surfaces, geometry and operating conditions.

Thermal interface performance

Record material, thickness, bonded area, heat load and temperatures to assess the interface temperature rise.

Peel and shear performance

Define substrate finish, application pressure, dwell, load direction and test temperature for meaningful comparisons.

Aging and assembly integrity

Review retention and thermal behavior after the agreed heat exposure, humidity or temperature cycling.

Representative substrates

Defined test conditions

An agreed acceptance plan

Build the acceptance plan around the way your product is used.

Plan Your Validation

Documentation That Follows Every Tape Batch

Connect the selected material and cut part to the information your engineering, purchasing and quality teams need.

Material definition

A material data sheet and the agreed thermal, adhesive and storage requirements identify what is approved.

Part and batch control

A controlled cut drawing, material reference and batch identification help keep repeat deliveries consistent.

Project documentation

Request material conformity information, inspection records and change control matched to the order requirements.

Tell us which documents your supplier approval process requires.

Request a Documentation Review

From Sample Fit to Repeat Supply

Move from interface review to an approved tape part, then keep the same material and drawing controls in repeat orders.

Phase 01

Review the requirement

Share surfaces, contact area, heat load, operating temperature and the attached mass.

Phase 02

Select and sample

Confirm a candidate material, cut geometry and liner format for fit and process trials.

Phase 03

Approve the joint

Validate thermal performance and retention, then freeze the material and cut drawing.

Phase 04

Repeat with control

Order against the approved part definition with batch identification and agreed packing.

Custom die-cut orders typically start at 500 pieces.

Storage life is commonly 6–12 months unopened, depending on the selected material and labeled conditions.

Start with a sample plan and a clear route to repeat orders.

Start a Tape Project

Answers Before You Specify Thermal Tape

Resolve the practical questions that affect material choice, mounting reliability and production handling.

Can thermal tape replace screws or clips?

It can retain suitable lightweight parts when the bonded area, temperature and load case are validated. Use mechanical retention where mass, peel forces, vibration or safety requirements demand it.

Is thermal tape the same as a gap pad?

Thermal tape provides an adhesive thermal interface and is typically thin. A gap pad is selected mainly to bridge a defined gap under controlled compression; the two require different assembly reviews.

How do I choose the thickness?

Start with flatness, roughness and the available footprint. Select the thinnest practical tape that achieves the required contact, then validate the joint.

Is every material electrically insulating?

Electrical insulation depends on the selected material and thickness. Specify the electrical requirement and verify the relevant material data and test evidence.

Can you provide custom die-cut shapes?

Yes. Share a drawing, material requirements and annual volume so we can review the outline, cutouts, liner handling and economical supply format.

What should I send for a quotation?

Send the contact dimensions, both substrates and finishes, operating temperatures, heat load, attached mass, cut drawing and expected order quantity.

Have a question specific to your assembly?

Ask an Engineer

Let’s Define Your Thermal Tape

Tell us how your parts meet, what they need to transfer and how they will be assembled. We’ll help you define the next step.

Material selection

Match thermal, adhesive and operating requirements.

Die-cut support

Define the outline and practical liner handling.

Assembly review

Check mating surfaces, load direction and placement.

Validation planning

Agree the test conditions for your joint.

Repeat supply

Keep material, revision and batch information connected.