Stage 01
Engineering samples
Typical first round: 1–5 pieces. Joint heat pipe development commonly takes 4–8 weeks for the first sample and test cycle.
Heat Pipe Heat Sinks
Move concentrated heat to a larger fin area with custom copper-water heat pipe assemblies engineered around your power, airflow and installation constraints.
Custom thermal paths
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Copper-water technology
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Prototype to production
Bring your hotspot, space and airflow requirements to our engineering team.
Discuss Your Heat Pipe Design
What Is a Heat Pipe Heat Sink?
A passive two-phase thermal assembly connects the heat source to a fin stack, spreading heat beyond the footprint of the contact base.
Copper contact base |
Collects heat from the device through the specified interface.
Sealed heat pipes |
Transfer heat by evaporation, condensation and capillary return.
Air-cooled fins |
Release heat to the surrounding airflow without a liquid loop.
Find the right thermal path for your device.
Review Your Cooling Concept
Give Heat a Better Path
Connect an intense or offset hotspot to the usable cooling area so the fin stack can work more effectively within your enclosure.
Reach the airflow
Route heat from an obstructed source toward the available air channel.
Use more fin area
Distribute energy across the condenser region rather than concentrating it at the base.
Fit the enclosure
Coordinate pipe routing, mounting clearance and fin geometry around the mechanical envelope.
Turn a difficult hotspot into a practical cooling layout.
Map Your Thermal ConstraintsHow Two-Phase Heat Transfer Works
A sealed copper-water heat pipe transports energy through a repeating evaporation and condensation cycle.
Closed-Loop Two-Phase Thermal Transport Cycle
Latent Vapor Flow
Capillary Liquid Return
Heat Source Contact
Evaporator Section
Phase Change: Liquid to Vapor
Hot Vapor Transit (Vapor Core)
Pressure gradient →
← Capillary pumping
Condensed Liquid Return (Sintered Wick)
Fin Stack Cooling
Condenser Section
Phase Change: Vapor to Liquid
Step 01
Evaporate
Working fluid absorbs heat at the evaporator.
Step 02
Transfer
Vapor carries energy toward the cooler condenser.
Step 03
Condense
Vapor releases heat into the fin region.
Step 04
Return
A sintered wick returns liquid by capillary action.
Design context: Pipe length, working temperature, orientation and geometry affect transport capacity.
Check the heat pipe cycle against your real operating conditions.
Start a Thermal ReviewA Defined Envelope for Custom Heat Pipe Assemblies
Use these manufacturing ranges to begin a design discussion, then confirm the combination against the heat load and installation conditions.
| Design Item | Typical Range | Engineering Consideration |
|---|---|---|
| Pipe outside diameter | 4 / 6 / 8 / 10 mm | Select with heat load and routing constraints. |
| Pipe length | 80–500 mm | Transport capacity changes with length and posture. |
| Assembly envelope | 60–350 × 60–400 × 20–120 mm | Dimensions are L × W × H. |
| Pipe construction | Copper-water, sintered wick | Validate at the intended operating temperature. |
| Common steady-state temperature | About 30–110 °C | Assess startup and cold conditions separately. |
4 Pipe Diameters
4, 6, 8, 10 mm copper tooling
80–500 mm
Scalable effective pipe length
Custom Geometry
Bespoke fin stack & contact base
Share your available envelope and operating temperature.
Check Design Feasibility
Engineered Radius & Precision Collar Joint
Route Heat Around Your Mechanical Constraints
Pipe geometry and condenser placement connect the contact zone to the available fin area while respecting the enclosure.
Bend with a purpose
Review bend radius, tooling access and tube wall integrity before freezing the route.
Flatten selectively
Assess remaining vapor area and wick condition when height is limited.
Validate the installed posture
Compare horizontal and permitted inclined positions at the specified load.
Make routing decisions before they become tooling changes.
Review Your Assembly LayoutMatch the Fins to the Installed Airflow
A heat pipe moves energy to the fin stack; the final cooling result still depends on the air that actually passes through it.
Heat Pipe Airflow Fixture
Fin spacing
Balance heat-transfer area with fan pressure and dust exposure.
Fan operating point
Use the pressure-flow curve and duct resistance together.
Air bypass
Guide air through the active fin channels and assess enclosure leakage.
Test record: Record installed airflow, inlet-air temperature, pressure drop and source geometry.
Build the cooling concept around your actual air path.
Discuss Airflow and Fin Design
Control Every Interface in the Thermal Path
The contact surface, interface material and pipe-to-fin connection work together to determine how reliably heat reaches the air.
Interface Level 01
Device-to-base contact
Coordinate flatness, mounting force and TIM thickness with the device limits.
Interface Level 02
Pipe-to-base connection
Control contact geometry, joining material and assembly positioning.
Interface Level 03
Pipe-to-fin connection
Maintain a consistent bond across the condenser region.
Interface Level 04
Mounting and durability
Check mechanical retention, vibration and thermal expansion for the installation.
Reduce avoidable resistance at each connection.
Define Your Interface Requirements
Heat Pipe Cooling for Demanding Electronics
Apply a tailored heat-transfer path where electronics need more cooling area than the hotspot footprint can provide.
Telecom power systems
Move offset power losses into the available rack airflow.
Industrial computing
Connect concentrated processors to constrained fin locations.
High-density power supplies
Spread local power-device heat across a larger fin stack.
Edge networking equipment
Coordinate multi-source heat paths inside compact enclosures.
450 W Telecom Power Cooling in an 80 mm Envelope
A Singapore telecom power project connected a 60 × 60 mm hotspot to a 200 × 250 mm fin region using eight 8 mm copper-water heat pipes.
Thermal Validation Metric
69.1 °C
Base Hotspot Temperature
0.098 K/W
Hotspot-to-inlet-air thermal resistance
Test Conditions
| Heat Load | 450 W |
| Inlet Air | 25 °C |
| Installed Airflow | 220 m³/h |
| Assembly Envelope | 200 × 250 × 80 mm |
| Installation | Design installation posture |
Physical Structure
Eight 8 mm copper-water heat pipes, aluminum zipper fins and copper contact block.
7 Weeks to Approval
7 weeks from samples to approval under mutual test protocol.
500-Piece First Batch
500-piece first delivery fulfilled on schedule for system pilot.
Vibration & Thermal Cycling
Vibration and −20 to 80 °C thermal-cycle screening under agreed procedure.
From Thermal Brief to a Controlled Assembly
A shared drawing and validation process keeps the heat pipe route, interfaces and acceptance criteria aligned from the first sample to repeat production.
STEP 01
01 Define
Confirm power map, source area, temperatures, airflow, space and posture.
STEP 02
02 Engineer
Coordinate base, pipe routing, fin stack, mounting and DFM.
STEP 03
03 Validate
Test the first assembly at the agreed load, airflow and posture.
STEP 04
04 Transfer
Freeze approved drawings, process controls and inspection records.
Keep engineering decisions connected to production requirements.
Plan Your Development ProcessVerify the Details That Keep Performance Consistent
Incoming heat pipe screening, controlled joints and defined thermal tests help maintain the approved assembly through repeat orders.
Incoming pipe screening
Check thermal response or transport consistency against the controlled specification.
Dimensions and assembly
Inspect mounting features, pipe positions, fin condition and contact surfaces.
Thermal validation
Define source geometry, load, inlet temperature, airflow, posture and measurement locations.
Traceable release
Link drawings, material batches, work orders and inspection records; manage critical changes through ECN.
Put measurable acceptance criteria into your drawing package.
Discuss Quality and ValidationA Practical Supply Path for OEM Programs
Start with engineering samples, establish a validated production configuration and scale with clear drawings, commercial terms and delivery planning.
Stage 02
Production quantities
Heat pipe assemblies typically begin at 20–50 pieces, depending on design complexity and tooling.
Stage 03
Repeat delivery
Typical production lead time: 30–45 days after drawings, sample approval, order and payment conditions are met.
Share your forecast and drawing maturity for a realistic supply proposal.
Request a Project QuotationHeat Pipe Heat Sink Questions, Answered
Clarify the design inputs that matter before selecting pipe quantity, fin geometry and the validation plan.
Can one 6 mm pipe carry a fixed wattage?
No. A common 6 mm pipe may transport about 20–50 W under specified length, temperature and posture conditions. Select from a validated performance curve rather than multiplying a nominal rating.
Does orientation matter?
Yes. Gravity, wick design and installation angle affect liquid return and transport capability; test the actual design posture.
Can heat pipes be bent or flattened?
Yes, within an approved forming process. Bending and flattening can reduce transport capacity, so validate the final formed part.
Do heat pipes replace airflow?
No. The fin stack still needs sufficient natural or forced convection to release the heat to the environment.
What should we send for an RFQ?
Send a drawing or envelope, heat map, continuous and peak loads, inlet temperature, temperature limits, airflow, posture and expected volume.
How do you define thermal resistance?
Hotspot-to-inlet-air thermal resistance is the base hotspot temperature minus inlet-air temperature, divided by the effective heat load under the recorded test conditions.
Bring the remaining questions to an engineering discussion.
Ask About Your Design
Let’s Build Your Heat Pipe Cooling Solution
Tell us where heat starts, where it needs to go and how your equipment operates. We will help define the next engineering step.
Custom pipe routing and fin geometry
Copper-water thermal design
Prototype and validation support
Controlled drawings and traceable production
English technical communication