Build Your Thermal Solution with Morton

Air & Liquid CoolingHeat sinks, heat pipe assemblies and liquid cold plates for industrial equipment.
Engineering Around Your NeedsMatch your heat load, space, mounting and operating conditions.
Traceable QualityDrawing revisions, inspection records and agreed acceptance criteria.
From Samples to SupplySupport for development samples, project orders and repeat production.
A Clear Next StepYour inquiry receives a response within one working day.

Start Your Thermal Project

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Thermal pads with machined cooling hardware on an engineering bench
CUSTOM THERMAL INTERFACES

Thermal Pads. Engineered for the Gap

Connect components to heat sinks, cold plates and enclosures with compliant, custom-cut thermal interfaces built around your assembly.

1–8 W/(m·K)
0.5–5 mm thickness
20–70 Shore 00
Bring us the gap. We will help define the interface.
Discuss Your Thermal Pad

A Compliant Bridge from Component to Cooling Surface

Soft thermal pads fill mechanical gaps and surface variation, giving heat a controlled path into the cooling structure.

Fill the real gap
Match thickness to the assembled distance, tolerance stack and selected compression window.
Move heat through the interface
Select conductivity together with compressed thickness, contact area and contact pressure.
Simplify repeatable assembly
Die-cut shapes, release liners and positioning features help operators install the same interface every time.
Turn an uneven interface into a defined assembly detail.
Review Your Interface
Soft blue-grey thermal pad with transparent release liner peeled at one corner

Understand the Path the Heat Takes

A pad manages the contact interface. The heat sink, cold plate or enclosure then carries that heat away.

Upward
Heat Flow
Cooling surface Heat Sink / Cold Plate
Rejection Boundary
Compressed thermal pad Compliant Interface
Conduction & Gap Fill
Component package IC / Power Device
Heat Source
PCB Substrate
Mechanical Support
Phase 1

Contact

Continuous contact replaces insulating air at the mating surfaces.

Phase 2

Conduction

Heat flows through the compressed pad thickness into the cooling surface.

Phase 3

Heat rejection

The cooling structure transfers heat to the airflow, coolant or enclosure exterior.

Define the complete path from package to cooling structure.
Map Your Thermal Stack

Specify the Material Around Your Operating Conditions

Use a coordinated material specification so thermal, mechanical and electrical requirements are checked together.

Property / Parameter Specification / Value
Thermal conductivity 1–8 W/(m·K)
Nominal thickness 0.5–5 mm
Hardness Approx. Shore 00 20–70
Operating temperature Common grades: −40 to 150°C
Compression design Often 10–30%; confirm the selected material curve
Electrical / flame properties Specified by material grade and supporting evidence

Test conditions

Compare material data at stated thickness, pressure and temperature.

Mechanical limits

Use compression stress data and the package load limit.

Application fit

Balance gap closure, thermal impedance and assembly force.

Share your operating window and the properties that matter.
Request Material Selection

Choose Thickness from the Assembled Gap

Start with the full tolerance range, then check compression at both the smallest and largest gap.

Engineering Compression Formula
Compression = (nominal thickness − assembled gap) / nominal thickness
Nominal pad 1.50 mm
Assembled gap 1.10–1.30 mm
At 1.30 mm gap 13.3% compression
At 1.10 mm gap 26.7% compression
Stack Deflection & Boundary Check 1.50 mm Nominal Specimen
Uncompressed
0.0% • 1.50 mm
Heat Sink
Pad: 1.50mm
IC Package
PCB
Free State
At 1.30 mm Gap
13.3% Comp.
Heat Sink
t = 1.30mm
IC Package
PCB
Min. Interface Contact
At 1.10 mm Gap
26.7% Comp.
Heat Sink
t = 1.10mm
IC Package
PCB
Max. Mechanical Force
01

Measure the stack

Include component height, board position, cooling surface and mounting tolerance.

02

Check both limits

Avoid loss of contact at maximum gap and excess force at minimum gap.

03

Confirm force

Use the selected pad stress curve at the target compression and temperature.

Send the gap range, not just a nominal dimension.
Check Pad Thickness

Move Heat Without Overloading the Assembly

Compliance must work with package limits, PCB support and controlled mounting travel.

Select by stress, not softness alone

Shore 00 hardness is useful for screening; the compression stress curve determines the applied load.

Control mounting travel

Stops, spacers or spring hardware help limit compression as screws are tightened.

Support the board

Place support near the loaded area and check package strain, board deflection and thermal expansion.

Mechanical Load Path & Displacement Stops Controlled Travel Cross-Section
STOP
Cold Plate / Heatsink Bracket
Thermal Pad (Controlled Window)
IC / Silicon Package
FR4 PCB Substrate
Under-Board Rigid Support Post
STOP
Clamping Force Absorbed by Hard Stops & Rigid Support
Assembly force = compression stress × loaded pad area
Use the material curve at the selected compression; do not infer force from hardness alone.
Balance thermal contact with a safe mechanical load.
Review Assembly Load

Keep Electrical Requirements in the Material Specification

Insulation, flame performance and cleanliness depend on the chosen grade, thickness and application.

Dielectric performance

Define test voltage, thickness and acceptance criteria for the selected material. Check the finished assembly where required.

Creepage and clearance

Keep electrical spacing in the hardware design. A thermal pad does not replace the required isolation distances.

Flame and compliance records

Request grade-specific flame rating evidence and current material compliance documentation.

Surface compatibility

Review silicone sensitivity, oil migration, contamination and the surfaces in contact with the pad.

Make the electrical and material requirements explicit.

Discuss Material Requirements

Look Beyond the Conductivity Number

Compressed thickness and contact area can matter as much as the conductivity value on a datasheet.

Bulk Resistance & Temp Rise vs. Conductivity Thermal Contribution
2 W/(m·K)
1.25 K/W ΔT = 12.5 K
4 W/(m·K)
0.625 K/W ΔT = 6.25 K
8 W/(m·K)
0.3125 K/W ΔT = 3.13 K
Engineering Formula
Bulk R = t / (k × A)
Standardized Conditions
A = 20 × 20 mm; compressed t = 1.0 mm; heat load = 10 W
Calculation Scope Note Calculated bulk contribution only. Contact resistance, spreading and the rest of the thermal path add to the assembly temperature rise.

Compare the interface under the conditions your assembly will use.

Compare Your Interface

Custom-Cut for the Way Your Team Assembles

Turn the approved material into an installation-ready shape with controlled dimensions and clear identification.

Die-Cut Pad & Release Liners
Pad Geometry & Handling
Die cut thermal pad
Top Protective Carrier Liner
Transparent PET film with extended finger pull-tab for peel stability
Precision Die-Cut Compliant Silicone Core
Toleranced to ±0.20 mm; clean CNC kiss-cut or rotary die perimeter
Optional Differential PSA Adhesive
Thermally conductive acrylic adhesive layer on component or heatsink side
Rigid Bottom Release Base
Heavy release liner sheeted or kiss-cut on roll for automated picking

Controlled geometry

DXF or PDF outlines define cutouts, keep-outs, holes and orientation features.

Handling options

Release liners and pull tabs help placement without stretching the pad.

Positioning support

Optional adhesive backing supports location; include its effect in the interface review.

Production identification

Part number, drawing revision and material lot keep pads aligned with the approved BOM.

Custom die-cut production commonly starts from 500 pieces; geometry and tooling determine the final batch.
Make the pad fit the drawing and the production line.
Send Your Pad Outline

Built for Interfaces Across Industrial Electronics

Match each pad to the local gap, load and cooling structure inside your equipment.

Open industrial power supply with thermal interface pads at the cooling housing

Industrial power supplies

Bridge magnetics and power devices to the housing where clearances and isolation requirements permit.

Fanless industrial computer with a thermal pad on the processor heat spreader

Industrial computing

Connect processors, chipsets and memory regions to a heat spreader or fanless enclosure.

Communications electronics with local thermal pads beneath a shared cooling cover

Communications equipment

Manage multiple device heights beneath a shared cooling cover while controlling board load.

Power conversion assembly with auxiliary thermal interfaces beside a sealed cold plate

Power conversion systems

Support defined auxiliary thermal interfaces around cold plates and power assemblies.

Show us where the interface sits inside your equipment.
Discuss Your Application

Coordinate the Pad with the Cooling Hardware

One interface review can align the thermal pad, mating surface and mounting details before the assembly is frozen.

Interface Stack
Extruded Heatsink Base
Pad Footprint
IC / Device

Heat sinks

Match the pad footprint to the base contact area; keep fins and airflow passages clear.

Liquid Boundary
IN
OUT
Sealed Cold Plate
Thermal Pad
Power Module / Package

Liquid cold plates

Specify the component-to-plate interface and mounting stops alongside the plate surface and coolant boundary.

Cast / Extruded
Chassis / Enclosure Lid
Gap Filler Pad
SoC / Processor

Thermal enclosures

Include enclosure flatness, board location and service access in the assembled gap calculation.

Bring the interface and cooling hardware into the same review.

Review the Complete Assembly

A Material Decision Your Quality Team Can Trace

Connect the approved specification to inspection records and delivery identification.

Material evidence

Grade-specific data covering conductivity method, thickness, hardness and electrical or flame properties.

First-piece approval

Dimensional inspection against the released drawing, with samples for fit and assembly checks.

Production control

Material lot, part number and drawing revision linked to inspection and shipment records.

Material datasheet
Dimensional / FAI record
CoC and traceability
RoHS / REACH information

Confirm the document scope and revision with the selected material and project.

Define the evidence your engineering and quality teams need.

Plan Your Approval Package

From Gap Definition to Repeatable Supply

Resolve the interface step by step, then carry the approved material and drawing into production.

STEP 01

Define

Send gap range, contact footprint, heat load, temperature limits and annual demand.

STEP 02

Review

Confirm material, compression window, mechanical load and cut geometry.

STEP 03

Validate

Check fit, interface temperatures and assembly behavior using project samples.

STEP 04

Release

Freeze the approved grade, drawing revision, inspection and packaging requirements.

Inquiry response
Within one working day
Drawing-based quotation
Usually 2–3 business days with complete information
Die-cut production
Commonly from 500 pieces
Storage control
Grade-specific sealed shelf life and storage conditions
Start with the assembly data you already have.
Start an Interface Review

Questions to Settle Before You Specify the Pad

Clear answers help thermal, mechanical and purchasing teams work from the same requirements.

Should I always choose the highest conductivity?
Choose the lowest total interface resistance that fits the assembly. Compressed thickness, contact resistance, pressure, area and material handling all affect the result.
How much compression should I allow?
A common starting window is 10–30%, then confirm the selected material stress curve, tolerance extremes and package load limit.
Can I stack pads to fill a larger gap?
Prefer a single approved thickness. Stacking adds interfaces and assembly variation; review it only when the construction has been specifically validated.
Will the pad electrically isolate the component?
Only a grade and thickness with suitable evidence can support that requirement. Specify voltage, environment and the final assembly test.
Can you supply cutouts, liners and adhesive backing?
Yes. Define geometry, handling and positioning requirements in the released drawing; review adhesive layers as part of the thermal interface.
What do you need to quote a custom pad?
Send the drawing or outline, gap range, conductivity target, electrical requirements, quantities and destination. Include the mating hardware when joint review is useful.
Resolve the details that could slow your next design review.
Ask an Interface Question
Thermal interface engineering workspace with pad samples and cooling components

Let’s Define Your Thermal Pad Interface

Send your drawing or gap requirements. Our team will help align the material, cut geometry and mounting conditions.

  • Application-focused review

    Gap, load and thermal conditions considered together.

  • Custom-cut supply

    Outlines, cutouts and handling features matched to the drawing.

  • Cooling hardware coordination

    Review the pad with your heat sink, cold plate or enclosure.

  • Approval documentation

    Material data and dimensional records for your project.

  • Production continuity

    Controlled material, drawing revision and lot identification.

Tell Us About Your Project
Attach a drawing (optional)
DXF, DWG, STEP, PDF up to 25MB

Your project information stays confidential. Initial response within one working day.